UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
A Contract Award Notice
by UK RESEARCH & INNOVATION
- Source
- Find a Tender
- Type
- Contract (Supply)
- Duration
- not specified
- Value
- £250K
- Sector
- INDUSTRIAL
- Published
- 15 Feb 2024
- Delivery
- not specified
- Deadline
- n/a
Concepts
Location
Oxfordshire
3 buyers
- UK Research & Innovation Swindon
1 supplier
- Inseto Andover
Description
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.
Award Detail
| 1 | Inseto (Andover)
|
Award Criteria
| PRICE | _ |
CPV Codes
- 31712000 - Microelectronic machinery and apparatus and microsystems
Indicators
- Award on basis of price.
Legal Justification
The original tender was terminated due to no compliant bids being received. Therefore we went down the negotiated procedure route and found a suitable quotation for the work needing to be carried out.
Other Information
Procurement Contract Transparency Data: Redacted contract documents will be made available within the next 30 days on the UKRI website at: https://www.ukri.org/about-us/procurement-contract-transparency-data/ To view this notice, please click here: <a href="https://ukri.delta-esourcing.com/delta/viewNotice.html?noticeId=842513727" target="_blank">https://ukri.delta-esourcing.com/delta/viewNotice.html?noticeId=842513727 GO Reference: GO-2024215-PRO-25182331
Reference
- FTS 005140-2024