UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

Concepts

• microelectronic machinery and apparatus and microsystems
• swindon
• microelectronic components
• wire bonding
• studding
• ukri-3441 ball bonder for studding and wire bonding
• a ball bonder for studding and wire bonding of microelectronic components
• a ball bonder
• wire
• ball

Location

Oxfordshire

Description

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.

Total Quantity or Scope

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision

Award Criteria

CPV Codes

• 31712000 - Microelectronic machinery and apparatus and microsystems

Indicators

• Bids should cover the whole contract.
• Renewals are not available.
• Award on basis of price and quality.

Other Information

The contracting authority considers that this contract may be suitable for economic operators that are small or medium enterprises (SMEs). However, any selection of tenderers will be based solely on the criteria set out for the procurement. For more information about this opportunity, please visit the Delta eSourcing portal at: <a href="https://ukri.delta-esourcing.com/tenders/UK-UK-Swindon:-Microelectronic-machinery-and-apparatus-and-microsystems./U2Q6E6ZKBN" target="_blank">https://ukri.delta-esourcing.com/tenders/UK-UK-Swindon:-Microelectronic-machinery-and-apparatus-and-microsystems./U2Q6E6ZKBN To respond to this opportunity, please click here: <a href="https://ukri.delta-esourcing.com/respond/U2Q6E6ZKBN" target="_blank">https://ukri.delta-esourcing.com/respond/U2Q6E6ZKBN GO Reference: GO-2023128-PRO-24723387