School of Physics & Astronomy: Inductively Coupled Plasma Reactive-Ion Etching System

Concepts

• dry etching equipment
• school of physics & astronomy
• guardbridge
• school of physics
• plasma reactive-ion etching system
• plasma reactive-ion etching
• high quality etching
• high etch rates
• low ion energy
• live detection of the etching progress

Location

UK-St Andrews

Description

The School of Physics & Astronomy is seeking to enhance its research and teaching activity through the acquisition of an Inductively Coupled Plasma Reactive-Ion Etching (ICP-RIE) system.

Total Quantity or Scope

We require an Inductively Coupled Plasma Reactive-Ion Etching (ICP-RIE) system for high quality etching (high etch rates, side wall angle control and low sidewall roughness) of - silicon, - silicon compounds (e.g. SiC, Si3N4), - compound III-V & compound II-VI semiconductors (e.g. AlGaInP, InGaP, AlGaAs, InP, GaAs, GaN, etc.), - dielectrics (e.g. ZnO2, TiO, ITO, Al2O3, ZrO2, etc.), - metals (e.g. Cr, Al, Ti, Au, W, Pt, etc.) and - organics (e.g. resists like SU8, S1818, etc and polymers like parylene, PS etc) containing an inductively coupled plasma (ICP) source for the generation of plasmas with high ion density, low ion energy and narrow energy distribution (ion energy and ion density are separately controllable via an included bias generator). The ICP-RIE etcher should be fully clean room-compatible. Wafers should be loaded into the etching chamber via a vacuum load lock for process stability, short process cycle times and safety issues. The substrate electrode should be He back-side cooled for dynamic, direct and very efficient temperature control of the substrate in a range of -20 °C to 150 °C, which may require the attachment of an external chiller (to be included in quotation). The etcher should be equipped with a laser interferometer to allow for live detection of the etching progress, and optionally also with an optical emission spectrometer for monitoring of chamber condition. The etcher should be compatible with fluorinated and chlorinated gases. The entire system should be operated from a PC (to be included in delivery).

Award Detail

Award Criteria

CPV Codes

• 22520000 - Dry-etching equipment
• 42122450 - Vacuum pumps
• 42124300 - Parts of air or vacuum pumps, of air or gas compressors

Indicators

• Award on basis of price and quality.

Other Information

All Tenders for the University of St Andrews are administered through our e-Tendering System (InTend). To Express an Interest please go to our tender website at: https://intendhost.co.uk/universityofstandrews Please note that 'Notes of Interest' placed via PCS (Public Contracts Scotland) are not automatically accepted. All tenders for the University of St Andrews are administered through our eTendering System (InTend). To Express an Interest please go to our tender website at: https://intendhost.co.uk/universityofstandrews. Please note that 'Notes of Interest' placed via PCS (Public Contracts Scotland) are not automatically accepted. (SC Ref:655776)