Chip Cleave & Break system

A Contract Award Notice
by CARDIFF UNIVERSITY

Source
OJEU
Type
Contract (Supply)
Duration
0.5 year (est.)
Value
£278K
Sector
INDUSTRIAL
Published
03 Mar 2023
Delivery
To 01 Sep 2023 (est.)
Deadline
n/a

Concepts

Location

Cardiff

Geochart for 2 buyers and 1 suppliers

2 buyers

1 supplier

Description

The ICS has a requirement for a Chip Cleave and Break tool for application with Electronic and Optoelectronic devices on a range of material platforms including Si-Photonics integrated with compound semiconductor chips, III-V material laser diode cleaving resulting in high quality mirror facets, bar to die separation and die singulation. The tool must be capable of automatic processing or manual mode operation, must be capable of handling up to 150mm wafers at least as well as small pieces or tiles of a wafer and must be compatible with subsequent process steps and tooling such as a Pick and Place tool

Award Detail

1 S3 Alliance (Londonderry)
  • Reference: cu.1013.th
  • Num offers: 1
  • Value: £278,000
  • Contractor is an SME.

Award Criteria

Quality 70.0
quality 70.0
PRICE 30.0

CPV Codes

  • 38000000 - Laboratory, optical and precision equipments (excl. glasses)

Indicators

  • Award on basis of price and quality.

Other Information

(WA Ref:129446)

Reference

Domains