UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

A Tender Notice
by UK RESEARCH & INNOVATION

Source
Contracts Finder
Type
Contract (Products)
Duration
1 year
Value
£180K
Sector
INDUSTRIAL
Published
08 Dec 2023
Delivery
09 Feb 2024 to 08 Feb 2025
Deadline
19 Jan 2024 14:00

Concepts

Location

Geochart for 1 buyers and 0 suppliers

1 buyer

Description

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.

CPV Codes

  • 31712000 - Microelectronic machinery and apparatus and microsystems

Indicators

  • Contract is suitable for SMEs.

Other Information

Please follow this link to view the notice https://www.delta-esourcing.com/tenders/UK-UK-Swindon:-Microelectronic-machinery...

Reference

Domains