UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

A Contract Award Notice
by UK RESEARCH & INNOVATION

Source
Contracts Finder
Type
Contract (Products)
Duration
5.5 month
Value
£250K
Sector
INDUSTRIAL
Published
15 Feb 2024
Delivery
15 Feb 2024 to 30 Jul 2024
Deadline
13 Feb 2024 00:00

Concepts

Location

Geochart for 1 buyers and 1 suppliers

1 buyer

1 supplier

Description

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.

Award Detail

1 Inseto (Andover)
  • Value: £250,000

CPV Codes

  • 31712000 - Microelectronic machinery and apparatus and microsystems

Indicators

  • Contract is suitable for SMEs.

Other Information

Please follow this link to view the notice https://www.delta-esourcing.com/delta/respondToList.html?noticeId=842513727

Reference

Domains