NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment

Concepts

• semiconductors
• nmis
• glasgow
• encapsulation equipment
• electronic equipment
• research facility
• electronic semiconductor designs
• overall facility
• wide variety of power
• wire bonding

Location

Glasgow

Description

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.

Total Quantity or Scope

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The initial focus will be procuring equipment as a 3 cell solution as Cell 6, Cell 7 and Cell 8 of a production line to support die bonding, wire bonding and encapsulation and associated ancillaries required. The University is seeking a supplier to supply, deliver and commission all of the equipment to provide the following overall capability: Cell 6: Die Attach - Automatic die bonding - Vacuum oven curing - Plasma cleaning Cell 7: Interconnection - Multi-head wire bonding - Ultrasonic bonding Cell 8: Encapsulation - Overmoulding - Dam and fill encapsulation - Oven curing

Award Detail

Renewal Options

The Contracting Authority reserves the right to request additional deliveries by the Successful Tenderer, either intended as partial replacement of suppliers or installations or as extensions of existing supplies and installations.

Award Criteria

CPV Codes

• 31712330 - Semiconductors
• 31710000 - Electronic equipment

Indicators

• Options are available.
• Award on basis of price.

Other Information

(SC Ref:771258)