Wafer Dicing Saw and Post Wafer Cleaning

Concepts

• southampton
• precision equipment
• wafer dicing
• post wafer cleaning
• dicing
• post
• cleaning
• saw
• wafer
• laboratory and optical equipment

Location

Description

The University of Southampton seeks to acquire a complete dicing system for the University's optical and semiconductor materials processing capabilities for a number of high-impact projects in the major engineering themes of Quantum Technologies, Photonics and Advanced Manufacturing. This system is a replacement for the current dicing saw for Building 53 back-end of line cleanroom facility and an upgrade to meet the demands of current projects and technologies. Dicing is a fundamental part of the cleanroom and underpins a significant number of ongoing and future grants. The acquisition of this system will enable university researchers to machine surfaces and micron sized ridge structures with nanoscale surface roughness and low amounts of topside chipping in optical and semiconductor materials. This dicing machine will allow the fabrication of new devices that will tackle fundamental research problems in quantum light-matter interactions, quantum sensors, and telecommunications.

Award Detail

CPV Codes

• 38000000 - Laboratory, optical and precision equipments (excl. glasses)

Indicators

• Contract is suitable for SMEs.