Lapping and Polishing Machine

A Tender Notice
by CARDIFF UNIVERSITY

Source
OJEU
Type
Contract (Supply)
Duration
0.5 year
Value
200K
Sector
INDUSTRIAL
Published
20 May 2022
Delivery
To 01 May 2023 (est.)
Deadline
21 Jun 2022 12:00

Concepts

Location

Cardiff

Geochart for 2 buyers and 0 suppliers

2 buyers

Description

A lapping and polishing machine capable of thin wafers up to 200mm in diameter

Total Quantity or Scope

Cardiff University is looking for a new lapping and polishing tool to thin wafers up to 200mm in diameter in a variety of materials such as Gallium Arsenide, Indium Phosphide, silicon, and silicon carbide. The University encourages bids from suppliers that have experience of supplying lapping and polishing machines to organisations of a similar nature in the UK preferably or Europe within the last 2 years, bidders must have supplied at least 5 units in the last 2 years.

Renewal Options

Additional 8" Jigs

Award Criteria

quality 70.0
PRICE 30.0

CPV Codes

  • 38000000 - Laboratory, optical and precision equipments (excl. glasses)

Indicators

  • Bids should cover the whole contract.
  • Options are available.
  • Renewals are not available.
  • Award on basis of price and quality.

Other Information

(WA Ref:121395)

Reference

Domains