Lapping and Polishing Machine

A Contract Award Notice
by CARDIFF UNIVERSITY

Source
OJEU
Type
Contract (Supply)
Duration
0.5 year (est.)
Value
£197K
Sector
INDUSTRIAL
Published
31 Oct 2022
Delivery
To 01 May 2023 (est.)
Deadline
n/a

Concepts

Location

Cardiff

Geochart for 2 buyers and 1 suppliers

2 buyers

1 supplier

Description

A lapping and polishing machine capable of thin wafers up to 200mm in diameter

Total Quantity or Scope

Cardiff University is looking for a new lapping and polishing tool to thin wafers up to 200mm in diameter in a variety of materials such as Gallium Arsenide, Indium Phosphide, silicon, and silicon carbide. The University encourages bids from suppliers that have experience of supplying lapping and polishing machines to organisations of a similar nature in the UK preferably or Europe within the last 2 years, bidders must have supplied at least 5 units in the last 2 years.

Award Detail

1 Logitech (Glasgow)
  • Num offers: 1
  • Value: £197,057
  • Contractor is an SME.

Renewal Options

Additional 8" Jigs

Award Criteria

quality 70.0
PRICE 30.0

CPV Codes

  • 38000000 - Laboratory, optical and precision equipments (excl. glasses)

Indicators

  • Options are available.
  • Award on basis of price and quality.

Other Information

(WA Ref:126025)

Reference

Domains