UKRI-3154 Indium deposition system

Concepts

• indium
• swindon

Location

Oxfordshire

Description

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.

CPV Codes

• 14763000 - Indium

Indicators

• Bids should cover the whole contract.
• Renewals are not available.
• Award on basis of price and quality.

Other Information

The contracting authority considers that this contract may be suitable for economic operators that are small or medium enterprises (SMEs). However, any selection of tenderers will be based solely on the criteria set out for the procurement. For more information about this opportunity, please visit the Delta eSourcing portal at: <a href="https://ukri.delta-esourcing.com/tenders/UK-UK-Swindon:-Indium./2J2786X87G" target="_blank">https://ukri.delta-esourcing.com/tenders/UK-UK-Swindon:-Indium./2J2786X87G To respond to this opportunity, please click here: <a href="https://ukri.delta-esourcing.com/respond/2J2786X87G" target="_blank">https://ukri.delta-esourcing.com/respond/2J2786X87G GO Reference: GO-2023927-PRO-24060381