UKRI-3154 Indium deposition system

Concepts

• indium
• swindon
• indium deposition system
• pure indium metal
• deposition
• ukri-3154 indium
• the deposition process
• system
• depositing
• semiconductor die

Location

Oxfordshire

Description

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.

Award Detail

Award Criteria

CPV Codes

• 14763000 - Indium

Indicators

• Award on basis of price and quality.

Other Information

The contracting authority considers that this contract may be suitable for economic operators that are small or medium enterprises (SMEs). However, any selection of tenderers will be based solely on the criteria set out for the procurement. Procurement Contract Transparency Data: Redacted contract documents will be made available within the next 30 days on the UKRI website at: https://www.ukri.org/about-us/procurement-contract-transparency-data/ To view this notice, please click here: <a href="https://ukri.delta-esourcing.com/delta/viewNotice.html?noticeId=833356262" target="_blank">https://ukri.delta-esourcing.com/delta/viewNotice.html?noticeId=833356262 GO Reference: GO-202415-PRO-24908448