UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

A Contract Award Notice
by UK RESEARCH & INNOVATION

Source
Find a Tender
Type
Contract (Supply)
Duration
1 year (est.)
Value
___
Sector
INDUSTRIAL
Published
15 Feb 2024
Delivery
To 14 Feb 2025 (est.)
Deadline
n/a

Concepts

Location

Oxfordshire

Geochart for 3 buyers and 1 suppliers

3 buyers

1 supplier

Description

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.

Award Detail

1 Unnamed (None)
  • CONTRACT NOT AWARDED – NO SUCCESSFUL BIDDERS.

Award Criteria

Quality 70.0
Price 30.0

CPV Codes

  • 31712000 - Microelectronic machinery and apparatus and microsystems

Indicators

  • Award on basis of price and quality.

Other Information

To view this notice, please click here: <a href="https://ukri.delta-esourcing.com/delta/viewNotice.html?noticeId=842499336" target="_blank">https://ukri.delta-esourcing.com/delta/viewNotice.html?noticeId=842499336 GO Reference: GO-2024215-PRO-25181972

Reference

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